Type |
Item |
Technical Parameter |
Remark |
Size |
the Max panel size |
700x1200mm |
Single, double |
600x1100mm |
Multi layers |
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board thickness |
Min board thickness |
0.2mm |
Single, double |
4 layers: 0.4mm; 6 layers:0.8mm |
Multi layer |
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8 layers:1.0mm 10layers:1.2mm 12layers:1.2mm |
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Max board thickness |
6.0mm |
Single, double |
|
8.0mm |
Multi layer |
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Bow & Twist |
≤ 7/1000 |
|
|
Material |
Material type |
FR4 |
|
Halgon free base material |
|
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Rogers4000 ceramic serials |
|
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High Tg0 |
|
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TP-2 Mixed |
|
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BT |
|
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AL/Copper Base laminate |
|
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PTFE material |
All PTFE |
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Arlon serials |
|
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Layer Construction |
Max layers |
30 layers |
|
Inner copper thickness |
0.5/1/2/3/4/6OZ |
|
|
Drill |
Min hole size |
Board thinkness≤ 2.0mm, the min hole size0.1mm |
|
Board thinkness>2.0mm, the aspect ratio 12:1 |
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Max hole size |
6.0mm |
|
|
PTH hole size tolerance |
±0.075mm |
|
|
NPTH hole size tolerance |
±0.025 |
|
|
PTH |
Min hole wall copper thickness |
20um |
|
Aspect ratio |
10:1 |
|
|
Circuitry |
Inner/outer Min line width/spacing |
3mil/3mil |
2.5mil space after compensation |
The Min line spacing between drill and inner layer |
0.18mm |
|
|
Min inner isolated ring |
0.3mm |
|
|
Layer registration |
0.1mm |
|
|
The Min annular ring |
3mil |
via hole |
|
6mil |
component hole |
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Plating |
Surface finished |
HAL, Immersion Ni/Au, Electro-plated Ni/Gold, Immersion Ti/Silver.OSP |
|
Finished copper thickness |
1-6OZ |
Outer copper thickness |
|
0.5-5OZ |
Inner copper thickness |
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Plating Ni/Au |
100-200 micro inches |
Nickel thickness |
|
1-50 micro inches |
Au thickness |
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Immersion Ni/Au |
80-150 micro inches |
Ni thickness |
|
1-20 micro inches |
Au. thickness |
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Plating gold finger |
120-150 micro inches |
Ni thickness |
|
1-40micro inches |
Au. thickness |
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Etch |
Cutting material copper thickness:1/3oz |
3mil |
min line width/spacing |
Cutting material copper thickness:1/2oz |
4mil |
min line width/spacing |
|
Cutting material copper thickness:1oz |
4-5mil |
min line width/spacing |
|
Cutting material copper thickness:2oz |
6mil |
min line width/spacing |
|
Cutting material copper thickness:3oz |
8mil |
min line width/spacing |
|
Cutting material copper thickness:4oz |
108mil |
min line width/spacing |
|
Solder mask |
Solder mask colour |
Green, light green, white,black, red,yellow,blue |
The single solder mask allowance:1mil |
Solder mask openning |
2-4mil |
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Solder mask bridge |
min:4mil |
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Wording |
Color |
white,black, red,yellow,blue, green |
|
Width |
5mil |
|
|
Heigth |
30mil |
|
|
Moulding |
CNC moulding tollerance |
±0.1mm |
|
|
±0.15mm |
|
|
V-CUT depth |
±0.1mm |
|
|
V-CUT deviation |
±0.1mm |
|
|
V-CUT angle |
20.30.60degree |
|
|
Space from the Line to board edge |
0.25mm |
Milling the shape |
|
0.4mm |
V-CUT |
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Reliable |
Flammability |
94V-0 |
|
Peel Strength |
12.3N/cm |
|
|
Insulation Resistance |
≥109Ω |
|
|
Impedance |
Tollerance:±10% |
|
|
Press test |
Min: 1500V |
|
|
Thermal Stress |
288℃,10s,3times |
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