Capacity

    Type

    Item

    Technical Parameter

    Remark

    Size

    the Max panel size

    700x1200mm

    Single, double

    600x1100mm

    Multi layers

    board thickness

    Min board thickness

    0.2mm

    Single, double

    4 layers: 0.4mm; 6 layers:0.8mm

       Multi layer

    8 layers:1.0mm 10layers:1.2mm 12layers:1.2mm

    Max board thickness

    6.0mm

    Single, double

    8.0mm

      Multi layer

    Bow & Twist

    ≤ 7/1000

     

    Material

    Material type

    FR4

     

    Halgon free base material

     

     Rogers4000 ceramic serials

     

    High Tg0

     

    TP-2 Mixed

     

    BT

     

    AL/Copper Base laminate

     

    PTFE material

    All PTFE

    Arlon serials

     

    Layer Construction

     Max layers

    30 layers

     

    Inner copper thickness

    0.5/1/2/3/4/6OZ

     

    Drill

     Min hole size

    Board thinkness≤ 2.0mm, the min hole size0.1mm

     

    Board thinkness>2.0mm, the aspect ratio 12:1

    Max hole size

    6.0mm

     

    PTH hole size tolerance

    ±0.075mm

     

    NPTH hole size tolerance

    ±0.025

     

    PTH

     Min hole wall copper thickness

    20um

     

    Aspect ratio

    10:1

     

    Circuitry

     Inner/outer Min line width/spacing

    3mil/3mil

    2.5mil space after compensation

    The Min line spacing between drill and inner layer

    0.18mm

     

    Min inner isolated ring

    0.3mm

     

    Layer registration

    0.1mm

     

    The Min annular ring

    3mil

    via hole

    6mil

    component hole

    Plating

     Surface finished

    HAL, Immersion Ni/Au, Electro-plated Ni/Gold, Immersion Ti/Silver.OSP

     

     Finished copper thickness

    1-6OZ

    Outer copper thickness

    0.5-5OZ

    Inner copper thickness 

    Plating Ni/Au

    100-200 micro inches

    Nickel thickness

    1-50 micro inches

    Au thickness

    Immersion Ni/Au

    80-150 micro inches

    Ni thickness

    1-20 micro inches

    Au. thickness

    Plating gold finger

    120-150 micro inches

    Ni thickness

    1-40micro inches

    Au. thickness

    Etch

    Cutting material copper thickness:1/3oz

    3mil

    min line width/spacing

    Cutting material copper thickness:1/2oz

    4mil

    min line width/spacing

    Cutting material copper thickness:1oz

    4-5mil

    min line width/spacing

    Cutting material copper thickness:2oz

        6mil

    min line width/spacing

    Cutting material copper thickness:3oz

      8mil

    min line width/spacing

    Cutting material copper thickness:4oz

    108mil

    min line width/spacing

    Solder mask

    Solder mask colour

    Green, light green, white,black, red,yellow,blue

    The single solder mask allowance:1mil

    Solder mask openning

    2-4mil

    Solder mask bridge

    min:4mil

    Wording

    Color

     white,black, red,yellow,blue, green

     

    Width

    5mil

     

    Heigth

    30mil

     

    Moulding

    CNC moulding tollerance

    ±0.1mm

     

     

    ±0.15mm

     

    V-CUT depth

    ±0.1mm

     

    V-CUT deviation

    ±0.1mm

     

    V-CUT angle

    20.30.60degree

     

    Space from the Line to board edge

    0.25mm

    Milling the shape

    0.4mm

     V-CUT

    Reliable

    Flammability

    94V-0

     

    Peel Strength

    12.3N/cm

     

    Insulation Resistance

    ≥109Ω

     

    Impedance

    Tollerance:±10%

     

           Press test

    Min: 1500V

     

    Thermal Stress

    288℃,10s,3times

     

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